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筑梦芯云 共赴未来

      江苏芯云电子科技有限公司成立于2016年,是一家立足于芯片自主研发,专注打造核心科技,在新能源、智能电网行业不断深耕的高新技术企业。拥有全资子公司南京杰思微电子技术有限公司,并在北京、厦门、广州以及海外设立研发分部,公司的芯片产品和解决方案服务于全国20多个省级电力公司和数十家上市公司,深受客户认可。
      芯云科技坚持与每一位员工彼此成就、共同进步的用人理念。公司的扎实发展得益于员工的全力支持,公司也致力于为员工提供优渥的薪酬、各项福利与关怀、舒适的工作环境、愉快的工作氛围,以及良好的晋升空间和团队综合培养。

Responsibilities:


1.  Responsible for extracting chip Spec functional points and designing verification plans and test cases.


2.  Responsible for building module-level and system-level verification platforms.


3.  Responsible for analyzing code coverage and functional coverage.


4.  Responsible for evaluating system performance and power consumption.


5.  Responsible for simulating and verifying RTL (Register-Transfer Level) and NETLIST design, as well as troubleshooting issues.


6.  Support ATE testing, prototype debugging, and productization problem-solving.


Qualifications:


1.  5 years or more experience in verification work.


2.  Bachelor's degree or higher in related fields such as Electronics, Communications, Computer Science.


3.  Familiar with UVM (Universal Verification Methodology) and verification platforms.


4.  Proficient in C, SV, Verilog, and at least one scripting language: Cshell, Perl, Python, etc.


5.  Familiar with ARM/RISC-V embedded CPU, AHB, APB protocols and related verification methods.


6.  Strong learning ability, good communication skills, and team collaboration spirit.


Responsibilities:


1.  Responsible for designing digital modules for chips.


2.  Responsible for encoding, integrating and simulating testing of digital modules.


3.  Responsible for debugging and troubleshooting FPGA prototypes for chips.


4.  Collaborate with verification, DFT (Design For Test), and backend engineers to complete design and validation work.


Qualifications:


1.  Master's degree or higher in relevant field, with 5 years or more experience.


2.  Strong professional foundation, self-motivated, and strong learning ability.


3.  Clear logical thinking, strong sense of responsibility, proactive, and strong team collaboration awareness.



Responsibilities:


1.  Responsible for designing and developing peripheral circuitry schemes, board card designs, and device parameter configurations for the company's ADC chip products.


2.  Responsible for building an ADC testing platform and completing debugging and self-testing on evaluation boards (EVBs).


3.  Participate in and guide the development of testing plans and test cases based on ADC product and system application requirements. Perform a comprehensive evaluation of ADC functionality and performance, and implement cost reduction measures.


4.  Lead analysis of customer issues, propose solutions, and implement them to improve customer satisfaction.


5.  Timely obtain competitive information and analyze and verify competitor products.


6.  Participate in defining the requirements, functions, and performance specifications for next-generation chips.


7.  Assist with evaluating and packaging ADC, EBMS chips.


8.  Perform other duties assigned.


Qualifications:


1.  Bachelor's degree or higher in Electronics Engineering, Communications, Computer Science, or related fields.


2.  Ability to adapt to short-term business trips.


3.  Clear logical thinking, strong sense of responsibility, proactive, and strong team collaboration awareness.